发明名称 EVALUATION DEVICE FOR THIN FILM ABRASION
摘要 PURPOSE:To simplify the constitution of a device and to facilitate measuring operation by irradiating a thin film material arranged in a vacuum chamber with excimer laser light, and evaluating its abrasion from the quantity of movement of the thin film material which moves as reaction to the abrasion. CONSTITUTION:The excimer laser light 3 emitted by an excimer laser 1 is projected on a sample 8 on a sample base 7 through an aperture 2, a total reflecting mirror 4, a quartz lens 5, and a quartz window 6. The sample base 7 has a hollow part as the passage of the laser light and the sample 8 is mounted straddling the hollow part. the sample 8 is normally irradiated with the excimer laser light 3 from below to cause abrasion. At this time, the sample 8 is scattered up vertically as reaction to the abrasion. The height of the scattering depends upon the degree of the abrasion and is read on a scale 9. This state is photographed by a television camera 11 and reproduced to accurately read the height.
申请公布号 JPS63157036(A) 申请公布日期 1988.06.30
申请号 JP19860304246 申请日期 1986.12.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUKAYA KUNIAKI;HORIUCHI NAOYA;ONO TAKUHIRO;IWABUCHI TAKASHI;MIYATA TAKEO
分类号 H01L21/66;G01N21/00;H01L21/302;H01L21/3065 主分类号 H01L21/66
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