| 摘要 |
PURPOSE:To prevent positional deviation as well as to form a silver solder member at a constant height by a method wherein a curved surface or a recessed part is formed on the contact surface of the silver solder member of a lead pin main body, and the silver solder member of almost spherical shape is joined through diffusion to the above-mentioned surface. CONSTITUTION:A lead pin 1 is composed of a lead pin main body 3 and a silver solder member 5, and a spherical member 5 is joined through diffusion to the upper surface of the top part of the main body 3. The main body 3 consists of a disc-shaped head part 31 and a cylindrical leg part 33. A curved surface 31c, which is concentrical to said upper surface, is formed on the upper surface 31b of the head part 31. On the other hand, the member 5 is formed almost in spherical shape. Accordingly, the member 5 is rolled after it has been guided to the curved surface, and it stops spontaneously at the center point located at the deepest position. Then, the member 5 is left in its original form, and the member 5 is joined through diffusion to the curved surface 31c without melting it. As a result, the positional deviation of the member 5 to be jointed can be prevented, and the height of said member 5 can also be maintained constant.
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