| 摘要 |
PURPOSE:To contrive reduction in mounting height of the semiconductor device on a printed wiring substrate by a method wherein the shape of the lead to be formed is changed in the semiconductor device having the lead on one side only of the body. CONSTITUTION:In the semiconductor device 1 on which a lead 1a is formed in the reverse direction every other piece of lead, the lead 1a is provided on one side of the body 1b, one lead 1a is bent once at the position of the inserting hole 2a of a printed wiring substrate 2, other lead 1a is bent once at the position 1 mm below the body 1b, and then it is bent again at the position of the inserting hole 2a of the substrate 2. In this example, the height of mounting can be reduced by 30%, but the measurement of L is increased in lateral direction. However, when four leads are arranged in parallel and compared in cubic volume, the mounting height can be reduced on the contrary. By forming the shape of the left and the right leads 1a asymmetrically as above- mentioned, the mounting height of the device 1 of the same body size can be reduced without changing the inserting position and the inserting interval of the inserting hole 2a of the substrate 2.
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