| 摘要 |
PURPOSE:To spread adhesive paste without generating air bubbles, and realize excellent die bonding, by a method wherein the adhesive paste is spread on a substrate retainer by applying a plurality of nozzles radially arranged on the substrate retainer of a lead frame. CONSTITUTION:A plurality of nozzles 10 to spread adhisive paste are radially arranged on the substrate retainer 1 of a lead frame in a die bonding method. The paste 3 is spread on the substrate retainer 1 the through nozzles 10; a die 4 is bonded on the substrate retainer 1 with the paste 3 by pressing down the die 4 on the paste 3. The nozzles 10 are arranged on one cross of an A row 11 and a B row 12, and the other cross of a C crow 13 and a D row 14 arrangement between the A row 11 and the B row 12. The nozzle equipment is constituted of a cylinder 16 to contain the paste 3 and a nozzle head 15 in which the nozzles 10 are arranged. Thereby, the generation of air bubbles and the like can be prevented, and the die 4 is tightly bonded with the substrate retainer 1. |
