| 摘要 |
PURPOSE:To execute satisfactory soldering without sepn. of solder powder and binder during storage by dissolving a specific ratio of PE with a specific ratio of toluene and further, mixing a specific ratio of an org. gelling agent therewith to prepare a binder for paste solder. CONSTITUTION:This binder for paste solder is prepd. by dissolving 40-85wt.% PE with 15-60wt.% toluene and mixing 0.25-3wt.% org. gelling agent further therewith. The sepn. of the solder powder and the corrosion thereof during storage are thereby obviated and the oxidation of base metals is prevented.
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