| 摘要 |
PURPOSE:To obtain the titled filler having excellent fluidity and using for producing a semiconductor device with little deteriorating property, by subjecting spherical alumina particles obtained by the high-temp. thermal spray method to the hydrothermal treatment. CONSTITUTION:The spherical alumina filler having 2-100mum mean particle size is obtained by treating an starting alumina having 0.1-100mum mean particle size contg. <=0.3wt% soda with the high-temp. thermal spray method. The titled filler is obtained by putting the above-mentioned particle in a pressure container such as an autoclave made of glass or stainless steel, etc., and subjecting the particle to a soda removing treatment that is practiced by subjecting the particle to the hydrothermal treatment at >=2kg/cm<2> pressure, at >=120 deg.C and for >=30min after adding water as an extracting agent and extracting a soluble soda- component. Then, a thermosetting resin composition for sealing is obtained by blending the obtained filler with a thermosetting resin such as an epoxy resin and together with a cross linking agent such as 2-ethyl-4-methylimidazol, silane coupling agent and carbon black, etc.
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