| 摘要 |
PURPOSE:To remove a defective semiconductor element completely in succeeding test steps, by providing a detecting means, which detectes a semiconductor element that has been left alone on a heater block for a long time, and providing a breaking/removing means, which receives the output of the detecting means and forcibly breaks or removes the semiconductor element. CONSTITUTION:When a semiconductor element, which has been left alone on a heater block 4 for a long time by some cause after die bonding, the number of counted pulses exceeds a specified value. Then a detecting part regards this semiconductor element 1 as defective. When the element 1 is sent out on a supporting stage 8, a driving signal is outputted to a breaking device 5 in a standby state. Then the breaking device 5 is lowered in the direction of an arrow A. Said semiconductor element 1 regarded as defective is broken with a rotating probe 7. Thus erroneous judgment in the succeeding testing steps is avoided, and reliability can be enhanced. |
