| 摘要 |
PURPOSE:To prevent disconnection of a metal wiring at a filler part and to increase productivity, by providing an insulating inorganic film between the surface of the filler, which is filled in a hole where an IC chip is embedded, and an insulating film, which is formed on a substrate and the IC chip. CONSTITUTION:An IC chip 6 is put in a hole 4 and fixed. An insulating inorganic film 20 comprising SiN and the like is formed from the rear side of a substrate 2 by a sputtering method or a CVD method. An insulator constituting the insulating inorganic film 20 passes through a gap between the hole 4 and the IC chip 6 from the rear side of the substrate 2 and reaches the surface of the IC chip 6. The insulating inorganic film 20 is formed from a copper foil plate 24 to the surface of the IC chip 6 at a part, where a bumps 22 are not present. After the insulating inorganic film 20 is formed to a thickness corresponding to the thickness of the bump 22, a resin such as epoxy resin as a filler 8 is filled in the gap between the hole 4 of the substrate 2 and the IC chip 6. Then the resin is cured.
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