| 摘要 |
PURPOSE:To obtain the titled composition having excellent moisture-absorption and moisture-resistance after soldering treatment as well as thermal shock resistance, by compounding silica powder heat-treated in the presence of a modified silicone resin, silicone rubber powder and a coupling agent. CONSTITUTION:100pts.wt. of silica powder having an average particle diameter of preferably 5-30mu is mixed with preferably 0.1-20pts.wt. of a modified silicone resin, preferably 0.1-20pts.wt. of silicone rubber powder (preferably having a free chlorine content of <=10ppm) and preferably 0.1-3pts.wt. of a coupling agent (preferably an alkoxysilane) and the composition is thoroughly dispersed with a mixer. The obtained mixture is heat-treated preferably at 70-150 deg.C for 0.5-30hr and the product is compounded to an epoxy resin composition to obtain the objective composition.
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