| 发明名称 |
Molding polyamide resin composition. |
| 摘要 |
<p>A molding polyamide resin composition comprising 100 parts by weight of (A) a poly(m-xylylenesebacamide) resin, and 1 to 20 parts by weight of (B) a crystalline polyamide having a melting point about 20-30 DEG C higher than that of the poly(m-xylylenesebacamide) resin (A).</p> |
| 申请公布号 |
EP0272503(A1) |
申请公布日期 |
1988.06.29 |
| 申请号 |
EP19870117705 |
申请日期 |
1987.11.30 |
| 申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
NOMURA, ISAO;NARITA, KENICHI;KUROKAWA, MASASHI |
| 分类号 |
C08L77/00;F02F7/00;(IPC1-7):C08L77/00 |
主分类号 |
C08L77/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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