| 摘要 |
PURPOSE:To simplify the structure of a washing scrubber for the reverse side of a wafer and to operate the scrubber stably by a method wherein the peripheral part on the reverse side of the vacuum-sucked wafer is washed again and is dried by turning this substrate at high speed. CONSTITUTION:Arms 1b which support turning rollers 1a and set the rollers upright or tilt the rollers inward and outward are provided; the space between the rollers is made wider by tilting the arms toward the outside; a wafer 13 is set at this space. After that, the arms 1b are tilted toward the inside and the outside; two or more rollers 1a are brought into contact with the peripheral part of the wafer so as to hold the wafer; the surface and the reverse side of the wafer are washed. The following are provided: a spinning chuck 7 whose diameter is smaller than a spinning chuck 5 and which vacuum-sucks the central part in a small area on the reverse side of the wafer and is revolved at high speed; a brush which washes the area which is larger than the vacuum-sucked part at the peripheral part on the reverse side of the wafer at the spring chuck 5. The peripheral part on the reverse side of the wafer is washed again and is dried by turning the wafer at high speed.
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