| 摘要 |
A chip mounter for automatically mounting an electronic part onto a substrate. The chip mounter has a sucker for vacuum-holding the electronic part, at least one pair of fingers capable of reciprocatively moving between an electronic part clamping position and a release position and of also moving vertically, and a guide for guiding the fingers so that they perform linear reciprocative movement. Positioners for clamping the electronic part are disposed on the respective distal ends of the fingers in such a manner that their positions are adjustable in the clamping direction.
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