发明名称 HEAT-SENSITIVE ADHESIVE MATERIAL
摘要 PURPOSE:To provide the title pressure-sensitive adhesive material which does not cause blocking at room temp. and can form a surface having semipermanent adhesion activity by heating, by providing a lower layer consisting of a binder contg. a tackifier and an upper layer consisting of a finely divided solid plasticizer and a binder on a substrate. CONSTITUTION:At least 30wt% tackifier (e.g., hydrogenated rosin having an m.p. of 50-100 deg.C) is added to an org. solvent soln. or aq. dispersion of a binder (e.g., an acrylic resin) to obtain a first soln. Separately, 30-50wt% finely divided solid plasticizer having a particle size of 0.5-10mm and compatibility with the tackifier (e.g., dicyclohexyl phthalate) and a dispersant (e.g., polyoxyethylene phenyl ester) are added to an aq. soln. or dispersion of the binder to obtain a second soln. The first soln. is applied to a substrate composed of synthetic paper and dried to form a lower layer of 5-20mum in thickness. The second soln. is then applied thereto in such an amount that the coated layer contains the solid plasticizer in an amount of 0.4-1.6 times by weight that of the tackifier. The coated layer is dried to form an upper layer.
申请公布号 JPS63154781(A) 申请公布日期 1988.06.28
申请号 JP19860300852 申请日期 1986.12.17
申请人 HOECHST GOSEI KK 发明人 KIMIMURA TAKAYOSHI;HIRANO TAKAYASU;KAJI MASATO
分类号 C09J7/02 主分类号 C09J7/02
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