| 摘要 |
PURPOSE:To increase the mounting density of substrates by a method wherein, within a semiconductor device with outer lead protruding from only one side of a package, the package is inclined in the direction of the tip of outer lead. CONSTITUTION:An outer lead 1 is bent so that the direction B of package 2 may make an oblique angle alpha with the direction A of the tip of outer lead 1. Thus, the mounting density of substrates 4 can be increased compared with conventional substrates 4 mounted with ZIP. Furthermore, when the taper angle betaon the surface of another package 3 is equalized with the oblique angle alpha, the mounting density of substrates can be further increased.
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