发明名称 Gas cooling body for semiconductor components
摘要 Between each pair of cooling flanges of the body is a recess to accommodate the point of a cooling flange of an adjacent body. The body parts are thus joined by the flange points being pressed into adjoining body part recesses so that between each flange and that of an adjacent body a channel, closed laterally, for a cooling gas current is formed. The two end parts (1a, 1b) of the cooling body have cooling flanges only on the side of their base part facing the other end part, and at least the base part of the one end part has its side turned away from the other part formed for bringing into thermic contact with a semiconductor component. The cooling body has one or more intermediary parts (50) successively arranged between the end parts, each with a base part with cooling flanges extending on both sides, and with a recess between each pair of flanges to accommodate the point of a cooling flange of an adjacent cooling body part. (Provisional basic advised week 8827)
申请公布号 SE455242(B) 申请公布日期 1988.06.27
申请号 SE19860004890 申请日期 1986.11.14
申请人 ASEA AB 发明人 G * ERIKSSON
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
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