| 摘要 |
PURPOSE:To assure the bonding process between bumps and lead terminals by a method wherein, in order to electrically connect the electrodes of semiconductor chip and lead terminals through the intermediary of bumps, the surface of bumps are flat-ground to maintain the same level. CONSTITUTION:A semiconductor wafer 13 fed from a loader part is firmly held on a stage to flat-grind bumps 2 formed on the wafer 13. In other words, a motor 20 holding a stone 19 is horizontally shifted making the axis of rotation maintain the same level. Thus, the bumps formed on the wafer 13 are flat- ground to make the level thereof even. Later, the wafer 13 is fed to bonding process to be bonded. Through these procedures, the bonding process between bumps 2 and corresponding inner leads can be assured in various positions.
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