| 摘要 |
<p>PURPOSE:To enable to test and measure the titled device without separating it individually by connecting at least one lead part to a joint via an electric insulation layer. CONSTITUTION:After forming an insulation resin layer 21 on a conductive metallic plate 20 and then providing a reinforcing metallic plate 22, the metallic plates 20 and 22 are etched to a fixed shape. Next, a package part 23 and said insulation layer 24 are formed by digging in said layer 21. Besides, fine grooves 25 are formed in the metallic plate 20 by etching, and accordingly the lead parts 27 having electrode parts 25 and 26 of island form insulation-isolated from each other in the package part 23 are formed. Since the lead parts 27 are connected to the joint (omitted in illustration) of lead frames via the insulation layer, a semiconductor pellet is contained in the package part 23 and thereafter can be tested without separating it.</p> |
