| 摘要 |
PURPOSE:To improve the reliability of the title device by a method wherein the cup liquid-tightly making contact with the lower circumferential part of the substrate to be treated and the second cup, which constitutes the sidewall of a housing part by liquid-tightly making contact with the above-mentioned cup, are constructed in such a manner that they perform a vertical movement relatively, and the plate to be processed is treated in a clean and uniform manner. CONSTITUTION:A lower cup 14 and an upper cup 15 are arranged on the housing part 37 of the developing solution of a semiconductor manufacturing device, a vertically moving driving part 39 is arranged outside the housing part 37, and the vertical movement of the housing part 37 is controlled by said driving part 39. The lower cup 14 is liquid-tightly contacted to the circumferential part of the lower surface of a wafer 5, the upper cup 15 is liquid-tightly contacted to the cup 14, and they constitute the sidewall of the housing part 37. The main air cylinder 32 coupled to a main rod 33 and an auxiliary air cylinder 34 are provided on the driving part 39, the cups 14 and 15 are vertically moved relatively by the driving of a motor 30, a developing solution 6 is stored in the cups which are liquid-tightly contacted with each other, and the wafer 5 can be developed accurately. |
