| 摘要 |
PURPOSE:To reduce processing cost and to enhance assembling workability, by a method wherein the mount screw inserted from a protective cover or substrate is screwed into the groove of a heat radiation plate to fix the protective cover, the substrate and the heat radiation plate in a superposed state. CONSTITUTION:At first, an external connection substrate 4 is preliminarily superposed to a heat radiation plate 23 and the ceramic substrate 3 integrated therewith so that an input terminal part 6a for a driver circuit and a substrate side connection terminal part 7a are superposed in corresponding relationship while a groove 22 coincides with a screw passing hole 4a. Next, a protective cover 11 is superposed to the substrate 4 so that the screw passing hole 4a coincides with a screw passing hole 10a. In this state, a mount screw 14 is inserted through the screw passing hole 10a or 4a and the screw shaft part 24 thereof is further screwed into the groove 22 of the heat radiation plate 23 to fix the heat radiation plate 23, substrate 4 and the protective cover 11 in a superposed state. |
