| 摘要 |
In a holder for a leadless chip-carrier (30) having a plurality of electrode pads (32) provided at external surface portions of the chip-carrier, the holder has mutually-opposed side-wall portions, for receiving and holding such chip-carrier therebetween, and a plurality of inner contact members (14) extending adjacent to the said side wall portions so as to make electrical contact respectively with the electrode pads of such leadless chip-carrier when the holder is in use, the said inner contacts being in electrical connection with respective external contacts (15) which are provided at outer surface portions of the said holder for connection to external circuitry. Such a holder can be incorporated in a semiconductor device module comprising a package and the holder. Such a holder can allow a leadless chip-carrier to be easily removed, for example for replacement. |
