| 摘要 |
PURPOSE:To omit an outer ring, to automate wafer alignment and to prevent erroneous chucking of a wafer ring, using a simple constitution, by sucking the wafer ring with vacuum, rotating the ring, and detecting the position of a the wafer with an alignment detector. CONSTITUTION:In a step before die bonding, a positioning mark 21 is automatically printed on a wafer sheet 5 in correspondence with an orientation flat 4 of a wafer 2. When a die bonder starts its operation, a sucking pad 17 is contacted with the wafer sheet 5. Vacuum force acts on the outer part of the sucking pad 17 with the actuation of a vacuum solenoid valve, and the wafer sheet 5 is sucked. For the position alignment of a the wafer 2, the rotating force of a pad rotating motor 19 is transmitted to the sucking pad 17 through a linking belt 20. A position aligning detector 18 detects the difference between the light reflections from the positioning mark 21 and the wafer sheet 5. The detected signal of the positioning mark 21 is sent to the pad rotating motor 19 and the motor is stopped. Under this state, the wafer 2 is conveyed to a chip recognizing part.
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