发明名称 CONNECTION OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make it possible to perform connection at a minute pitch without heating, by using a photocuring insulating resin as a connecting material. CONSTITUTION:The overlapping part of an electrode 2 of a display panel 1 and a wiring electrode 5 of a flexible substrate 3 is compressed 7 with a compressing jig 6. Under the compressed state 7, a photocuring resin is dropped through a nozzle 8 and applied on the vicinity of the compressing jig 6 and overlapped regions 9, 9' and 9'' of the electrodes 2 and 5. As the photocuring resin, acrylic, butadiene, epoxy or silicon resin or the like used. Under the compressed state 7, ultraviolet rays of far ultraviolet rays are projected 10 and 10' in the vicinity of the compressed part and the region to which the photocuring resin is applied. Since the photocuring insulating resin is used in this way, the minute electrodes can be connected without electric short circuits.
申请公布号 JPS63151031(A) 申请公布日期 1988.06.23
申请号 JP19860299418 申请日期 1986.12.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HATADA KENZO
分类号 H01L21/60;H05K3/32;H05K3/34;H05K3/36 主分类号 H01L21/60
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