| 摘要 |
PURPOSE:To obtain a fiber-reinforced resin composite excellent in, e.g., heat resistance, interface adhesiveness, drillability and dimensional stability and suitable as, e.g., a material for printed circuit boards, by adding an aromatic polyamide fiber treated with a lactam compound to a heat-resistant resin. CONSTITUTION:An aromatic polyamide resin [e.g., poly(p- phenyleneterephthalamide) or poly(m-phenyleneterephthalamide) resin] is dried and treated with a solution of a lactam compound by immersion, coating or the like. Examples of the lactam compounds which can be suitably used include epsilon-caprolactam, delta-valerolactam, etc. The aromatic polyamide fiber treated with the lactam compound is added to a heat-resistant resin to obtain the purpose fiber-reinforced resin composite. Examples of the heat-resistant resins which can be suitably used include thermosetting resins such as polyimide resins and epoxy resins. |
