| 摘要 |
PURPOSE:To simplify the operation of resin-film wipe-off finishing of an IC substrate, to reduce running cost and to improve a finishing state by dipping a ceramic substrate suspended by a hanger into a resin material and pulling up the ceramic substrate, lowering and pushing the lower end surface of the ceramic substrate to a transfer belt, on a lower surface of which a floorplate is laid, once or plural times and transferring and removing an excess adhesive resin material in an undried state. CONSTITUTION:A part 21 is loaded onto a ceramic substrate 20, the substrate 20 holds a terminal 22 and is suspended while the substrate is dipped into a resin material mainly comprising an epoxy group resin and being diluted with a mixed solvent and pulled up, and lowered onto the upper surface of a transfer belt 1 within the resin material (b) uncured time of thirty sec or sixty sec, and the lower end section of the ceramic substrate 20 is brought into contact and an excess adhering resin material (b) is transferred onto the said transfer belt 1 and removed. The resin material (b) is transferred and gotten rid of in such a manner that a hanger 13 is lifted and brought down several times while an intermediate drive motor 7 is driven when the hanger 13 is elevated, and the resin material is transferred while moving the transfer belt 1. The transfer belt 1 is constituted of an silicon belt having hardness of 40 degree or more or a Teflon belt of 0.3mm or less in thickness.
|
