发明名称 |
PRE-TREATMENT OF BERYLLIUM COPPER ALLOY |
摘要 |
PURPOSE:To set free the excess and deficiency of etching and to improve the reliability of plating to be subjected thereon by removing an electrolytic smut generated on the surface of a Be-Cu alloy by a chemical method in the etching of electrolytic pickling in which the Be-Cu alloy is set to an anode. CONSTITUTION:The etching of the electrolytic pickling is executed by setting the Be-Cu alloy as the anode in an aq. acid soln; at that time the electrolytic smut generated on the surface of the Be-Cu alloy is immersed in the aq. acid soln. and subjected to the etching to remove said smut by the chemical method. Said Be-Cu alloy is then subjected to the plating.
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申请公布号 |
JPS63149399(A) |
申请公布日期 |
1988.06.22 |
申请号 |
JP19860294177 |
申请日期 |
1986.12.10 |
申请人 |
HITACHI CABLE LTD |
发明人 |
KODAIRA MUNEO;OKABE NORIO |
分类号 |
C25D5/34;C23G1/10;C25F1/04 |
主分类号 |
C25D5/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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