| 发明名称 |
SEALANT FOR INTEGRATED CIRCUIT MODULES, POLYESTER SUITABLE THEREFOR AND PREPARATION OF POLYESTER |
| 摘要 |
<p>Integrated circuit module wherein the cap is sealed to the substrate with a liquid crystalline polyester melt containing about 25 to about 100 mole percent of recurring Units I and O to about 75 mole percent of recurring Units II wherein <IMAGE> +TR <IMAGE> wherein each R and R2 is arylene or cycloalkylene or alkylene or alkylidene.</p> |
| 申请公布号 |
EP0139924(B1) |
申请公布日期 |
1988.06.22 |
| 申请号 |
EP19840109403 |
申请日期 |
1984.08.08 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ECONOMY, JAMES;SUSKO, JOHN RICHARD;VOLKSEN, WILLI;WHEATER, ROBIN ANNE |
| 分类号 |
C08G63/00;C08G63/60;C09J167/00;C09K3/10;H01B3/42;H01L23/10;H01L23/29;H01L23/31;(IPC1-7):H01L23/10;H01L23/28 |
主分类号 |
C08G63/00 |
| 代理机构 |
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代理人 |
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