| 摘要 |
PURPOSE:To avoid improper bonding by supplying a bonding material to a bonding groove provided to opposite end to a magnetic gap of a bonding part of a couple of core blocks, melting the bonding member by heat so as to bond and fix a couple of the core blocks. CONSTITUTION:The core chip 24 is formed by bonding a couple of 'Sendust(R)' alloy made cores 26, 27 by a silver soldering member 28, a magnetic gap (g) is formed to the upper part of the bonding part of both the cores 26, 27 and the silver solder 28 is used to V-shaped bonding grooves 29, 30 at the lower part of the bonding part. Magnetic gap guard glass 31 is welded to both upper sides of the core chip 24 and winding grooves 32-34 are formed to the upper part of the side face of the cores 26, 27. A couple of blocks 35, 36 are tightened by a jig 39 and a combined core block 43 of both the blocks 35, 36 is pressed to other side wall 39a via a leaf spring 41 and a pressing plate 42 by a threaded rod 40, heated by an infrared ray source lamp 47 of an infrared ray heater 45 to melt the silver solder 28' thereby soldering a couple of blocks 35, 36 incorporatedly.
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