| 摘要 |
PURPOSE:To manufacture a high strength Cu alloy having high electrical conductivity and improved heat resistance by adding specified percentages of Ni, Si and B to Cu. CONSTITUTION:A Cu alloy consisting of 0.4-4.0wt% Ni, 0.1-1.0wt% Si, 0.001-0.1wt% B and the balance Cu with inevitable impurities is manufactured. The alloy may further contain 0.001-3.0wt% in total of one or more kinds of elements selected among Zn, P, Sn, As, Cr, Mg, Mn, Sb, Fe, Co, Al, Ti, Zr, Be, Ag, Pb and lanthanoids as secondary components and the amt. of O among the impurities is restricted to <=0.020wt%. A high strength Cu alloy having high electrical conductivity and suitable for use as a lead material for a semiconductor device or an electrically conductive spring material is obtd.
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