发明名称 METHOD FOR VAPOR-DEPOSITING MULTILAYER INTERFERENCE FILM
摘要 PURPOSE:To uniformize the thickness of film by opening a second shutter having a smaller shutdown face than a first shutter between a vaporization source and a material to be vapor-deposited after the spray from the vapor deposition source is stabilized. CONSTITUTION:The second circular shutter 5 for blocking the spray having a smaller shutdown face than the first shutter 4 is set in front of the shutter 4 arranged before the vaporization source 1. The vaporization source 1 is heated, the shutter 4 is opened as shown by the full line, and the vaporized molecules from the vaporization source 1 are allowed to reach the revolving and rotating material 2 to be vapor-deposited. At this time, since the shutter 5 is closed, the spray generated in the vicinity of the center of the vapor stream is deposited on the shutter 5. Since the shutdown face of the shutter 5 is small, the radiation angle of the vapor stream can be sufficiently reserved, hence the vaporized molecules except the spray can be allowed to reach the material 2 to be vapor-deposited. When the spray generation is eliminated, the shutter 5 is opened, and the vapor-deposition rate can be returned to normal. Since the spray can be blocked in this way, a multilayer interference film can be formed in uniform thickness.
申请公布号 JPS63149367(A) 申请公布日期 1988.06.22
申请号 JP19860296908 申请日期 1986.12.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OZAKI TOYOICHI
分类号 C23C14/06;C23C14/24 主分类号 C23C14/06
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