| 摘要 |
PURPOSE:To densify an inner pattern part, by forming parts exclusive of the inner pattern part including an inner lead part by press working and then forming the inner pattern part by etching work. CONSTITUTION:Parts exclusive of an inner pattern part 8 including an inner lead part 2 are formed by press work, and then the inner pattern part 8 is formed by etching work, and hence both advantages of the press work and the etching work can be assembled. Namely, later processes such as etching work and assembly of semiconductor device are performed with high precision by the use of high-precision guide holes 6 on rail parts 5, and besides a multi-pin lead frame 10 with the inner pattern parts 8 densified can be easily manufactured.
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