| 摘要 |
PURPOSE:To clean transfer-molding molds highly efficiently by a method wherein a cleaning sheet is held between a pair of the transfer-molding molds before transfer-molding and heat and pressure are applied and the molding surfaces of a pair of the transfer-molding molds are cleaned by the cleaning sheet. CONSTITUTION:A cleaning sheet is held between a pair of transfer-molding molds before transfer-molding and heat and pressure is applied and the molding surfaces of a pair of the transfer-molding molds are cleaned by the cleaning sheet. The cleaning sheet is made of, for instance, unvulcanized rubber base composed of unvulcanized rubber and removing agent. With this constitution, the molds can be cleaned easily, an offensive smell can be avoided and burrs can be removed safely so that a semiconductor device can be manufactured with a high efficiency. |
