| 摘要 |
PURPOSE:To improve controllability of the dimensions of a pattern by a method wherein a surface reflectance measuring instrument is provided and the revolu tion and rotating time of a substrate is controlled in accordance with the mea sured value of the surface reflectance. CONSTITUTION:The surface reflectance of a wafer W which is carried out of a wafer loader 1 is measured by a surface reflectance measuring instrument 2. The measured value is transmitted to a spin motor controller 5 and the revolution and rotating time of a spin motor 6 which provide conditions under which the surface reflectance after photoresist coating is made to be constant are given to the spin motor 6. A photoresist film is formed under the revolution and the rotating speed in a coating cup 3 and the wafer W is carried into a wafer unloader 4. With this constitution, the surface reflectances of the respec tive wafers can be the same and, when the same exposure energy is applied, the same dimension can be reproduced so that the controllability of the dimensions of a pattern can be improved.
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