Electronic component

摘要

The electronic component includes a mounting substrate having a surface provided with a plurality of spaced contact pads. A semiconductor chip is mounted on the substrate and includes at least one active element in the form of a photodiode on a substrate of light transmissive material. The active element has a metallized contact region and the semiconductor chip has a plurality of projecting metallized contact regions which are each electrically conductively bonded to a different one of the spaced contact pads of the mounting substrate. The photodiode may be a PIN diode and the semiconductor chips may be an integrated circuit to which the PIN diode is connected thereby providing an optical receiver equivalent to a PIN receiver.