THERMALLY ENHANCED INTEGRATED CIRCUIT CARRIER PACKAGE

摘要

THERMALLY ENHANCED INTEGRATED CIRCUIT CARRIER PACKAGE An integrated circuit carrier package complimented with a mass of highly conductive spherical bodies fused into a semi-random porous lattice matrix. Such component thus resembling a heatsink with generally fin-like structures that are generally arranged diagonally about the base carrier and coated with material(s) which enhance thermal radiation discharge to the surroundings. The carrier package with said intrinsic heatsink thus transmits substantial heat fluxes away from the semiconductor material for enhanced operational domains.