| 摘要 |
PURPOSE:To align mutual positions of an IC chip element and a circuit substrate easily by aligning the IC chip element with the circuit substrate by an infrared see-through method. CONSTITUTION:After mutual alignment between an IC chip element 1 which has an infrared light transmitting chip forming substrate 2 and non-light- transmitting pad electrodes 3 lead out from the substrate 2 and a circuit substrate 10 on which the chip element 1 is mounted is performed by an infrared see-through method, face-down bonding is carried out. By the infrared radiation 4 which is transmitted through the IC chip element 1, the patterns of the non- light-transmitting pad electrodes 3 are seen-through and, further, protruding electrodes against which the pad electrodes 3 are pressed are also seen-through. With this constitution, a highly accurate mechanical feeder can be eliminated and the mutual alignment at the time of bonding can be performed easily and economically.
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