| 摘要 |
A method of producing an IC card in which an IC module is embedded, the method including preparing at least one first resin core sheet having a through hole at a position at which the IC module is to be embedded and at least one second resin core sheet having no hole at a position corresponding to the through hole, disposing adhesive sheet having an area greater than that of the through hole on the first resin core sheet covering the through hole, superposing the first and second resin core sheets with the adhesive sheet therebetween, fitting the IC module into the through hole of the first resin core sheet, heating and pressing the IC module and the resin core sheets to form an integral structure, and applying at least one surface protection sheet to the integral structure to complete the card. |
