发明名称 |
PREPARATION OF PLASTIC MOLDING |
摘要 |
PURPOSE:To prepare a plastic molding having a projecting pattern of a uniform thickness, by molding a plastic by using a mold wherein a recessed pattern is only partly formed. CONSTITUTION:A fixed mold 3a wherein a circuit network 3a is engraved is tightly coated with a masking material 4 having a cutout part 4a. The surface of the masking material is then coated with a powder paint 2a by means of an electrostatic coating machine 5. Then, the masking material 4 is removed and the powder paint 2a is plasticized by heating. In a molding process, movable mold 3a is placed on the fixed mold 3a and the molds are closed. A molten plastic material is filled in the gap of the molds from a filling hole 3b' and is molded. By opening the molds, a plastic molding 1 wherein a circuit pattern 2 is tightly anchored can be obtained.
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申请公布号 |
JPS63147617(A) |
申请公布日期 |
1988.06.20 |
申请号 |
JP19860295165 |
申请日期 |
1986.12.11 |
申请人 |
DAINIPPON TORYO CO LTD;TOKAI KOGYO KK |
发明人 |
SAKAKIBARA TAKAO;NAGASHIMA YOSHIHISA;ITO TOSHIKAZU |
分类号 |
B29C33/42;B29C37/00;B29C41/00;B29C45/14;B29C45/16;B29C45/26 |
主分类号 |
B29C33/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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