EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

摘要

PURPOSE:To obtain the titled composition capable of imparting high moisture resistance to prevent the metal corrosion of a semiconductor with impurity ions, by compounding an inorganic ion exchange material composed mainly of Sb and Bi to an epoxy resin. CONSTITUTION:The objective composition can be produced by compounding (A) an epoxy resin (preferably an o-cresol novolac epoxy resin having an epoxy equivalent of 180-220) with (B) an inorganic ion exchange material containing antimony and bismuth as main constituent components [preferably the compound of formula SbBixOy(OH)z(NO3)w.n(H2O) (x is 0.2-2.0; y is 1.0-5.0; z is 0.1-3.0; w is 0.1-3.0; n is 0.5-3.0) in an amount of preferably 0.1-10wt%. The ion exchange material is preferably fine powder having an average particle diameter of <=5mu and a maximum particle diameter of <=100mu.