发明名称 METHOD AND DEVICE FOR FORMING THIN FILM
摘要 PURPOSE:To form various thin films having uniform quality and thickness at a high speed with good reproducibility with a thin film forming device having a film forming chamber provided with a plasma generating chamber and a substrate, by controlling the spacing between the plasma generating chamber and the substrate to a specified spacing and forming the films. CONSTITUTION:The film forming chamber 1 having the plasma generating chamber 4 and the substrate 3 to be formed with the film is hermetically closed and after the inside thereof is evacuated to a vacuum by a vacuum pump 17, gaseous CH4 of a raw material and gaseous Ar 9 are introduced into the chamber 4. The gaseous mixture composed of CH4 and Ar is converted to plasma by a high-frequency power supply 6 and a plasma generating electrode 7 wound around the chamber 4. The spacing between the substrate 3 and the chamber 4 is controlled to specified spacing by using a gas pressure detector 10, by which the ions contg. C atoms are accelerated by a DC power supply 5 and a meshed electrode 8 toward the substrate 3 and the thin diamond-like carbon film having the uniform quality and thickness is formed at the high speed on the substrate 3.
申请公布号 JPS63145774(A) 申请公布日期 1988.06.17
申请号 JP19860294001 申请日期 1986.12.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MITANI TSUTOMU;KUROKAWA HIDEO;YONEZAWA TAKETOSHI
分类号 C23C14/54;C23C16/27;C23C16/50;H01L21/205 主分类号 C23C14/54
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