发明名称 |
METHOD AND DEVICE FOR FORMING THIN FILM |
摘要 |
PURPOSE:To form various thin films having uniform quality and thickness at a high speed with good reproducibility with a thin film forming device having a film forming chamber provided with a plasma generating chamber and a substrate, by controlling the spacing between the plasma generating chamber and the substrate to a specified spacing and forming the films. CONSTITUTION:The film forming chamber 1 having the plasma generating chamber 4 and the substrate 3 to be formed with the film is hermetically closed and after the inside thereof is evacuated to a vacuum by a vacuum pump 17, gaseous CH4 of a raw material and gaseous Ar 9 are introduced into the chamber 4. The gaseous mixture composed of CH4 and Ar is converted to plasma by a high-frequency power supply 6 and a plasma generating electrode 7 wound around the chamber 4. The spacing between the substrate 3 and the chamber 4 is controlled to specified spacing by using a gas pressure detector 10, by which the ions contg. C atoms are accelerated by a DC power supply 5 and a meshed electrode 8 toward the substrate 3 and the thin diamond-like carbon film having the uniform quality and thickness is formed at the high speed on the substrate 3.
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申请公布号 |
JPS63145774(A) |
申请公布日期 |
1988.06.17 |
申请号 |
JP19860294001 |
申请日期 |
1986.12.10 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MITANI TSUTOMU;KUROKAWA HIDEO;YONEZAWA TAKETOSHI |
分类号 |
C23C14/54;C23C16/27;C23C16/50;H01L21/205 |
主分类号 |
C23C14/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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