| 摘要 |
PURPOSE:To reduce the fluctuation or the like of the swell and thickness of cutting planes caused by the deflection of blades by proportionally changing the moving speed of a workpiece synchronously with the reciprocating speed of the blades on cutting a semiconductor material or the like. CONSTITUTION:Multiple blades 1 held by spacers 2 at a predetermined distance are reciprocated, and a workpiece A is lifted by a stepping motor at the moving speed synchronous with the reciprocating speed of the blades 1 to be cut via abrasive grains. For example, the number of pulses for the stepping motor is set to about 200/sec, the number of reciprocating strokes for the blades 1 is set to about 60/min, and the lifting speed of a table fixing the workpiece A is adjusted so that the product of the reciprocating speed of the blades 1 and the time interval between pulses of 200pps is made constant. Accordingly, the fluctuation of the swell, thickness, etc. of cutting planes caused by the deflection of blades can be reduced, highly precise cutting can be performed, and the yield of a work and the work efficiency can be improved. |
