发明名称 |
CERAMIC/ORGANIC MULTILAYER INTERCONNECTION BOARD |
摘要 |
A multilayer board comprising a novel construction of ceramic and organic layers to reduce difficulties commonly encountered by board materials and components attached thereto having differing thermal coefficients of expansion. The multilayer board comprises an inorganic ceramic surface which is affixedly attached via a compliant adhesive to a conventional plated up post or plated thru hole organic multilayer board. |
申请公布号 |
AU1108188(A) |
申请公布日期 |
1988.06.16 |
申请号 |
AU19880011081 |
申请日期 |
1987.05.26 |
申请人 |
ROCKWELL INTERNATIONAL CORPORATION |
发明人 |
JOSEPH MICHAEL SHAHEEN |
分类号 |
H05K1/03;H05K1/11;H05K3/24;H05K3/38;H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|