| 摘要 |
PURPOSE:To make it possible to mount an end surface emitting type optical semiconductor device without adjustment in three axial directions, by providing a protruding part in a recess part of an optical-device mounting board at a specified height lower than the position of a light guide. CONSTITUTION:A recess part 15, which is slightly larger than a semiconductor laser element, is provided in an optical-device mounting board 6 having a light guide 7. An electrode 4a, which is connected to an electrode on the semiconductor laser device 1 through a connector 3, is provided on the recess part 15. A protruding part 5 is provided in the vicinity of the center of the semiconductor laser device 1 at a height, where the light emitting plane of an end surface emitting type optical semiconductor device 1 agrees with the optical axis of the light guide 7. Therefore, the position alignment on a Y-Z plane is performed by the self-aligning function of the connector 3. The position alignment on the X-Z plane is performed by the butting of the optical semiconductor laser device 1 and the protruding part 4, whose height accuracy of the surface is accurately set. Thus the position alignment in the three axial directions of X-Y-Z can be performed without adjustment. |
