| 摘要 |
PURPOSE:To enable the high-frequency characteristics to be measured with high precision while facilitating the cleaning of probing needle ends by a method wherein a wafer holder movable upward and downward in such a state wherein probing needles are fixed upward while a semiconductor wafer is held downward is provided above the brobing needles. CONSTITUTION:A probing stage 3 and probing needles 4a, 4b are fixed on a specified positions upward while a wafer holder 2 movable upward and down ward is provided above the stage 3 and needles 4a, 4b. A semiconductor wafer 1 is held downward by the wafer holder 2 by vacuum suction etc. In case of measurement, the wafer holder 2 is lowered to bring the probing needles 4a, 4b into contact with input.output ends of IC chip to measure the high-frequency characteristics by a high-frequency characteristics measuring instrument through the intermediary of coaxial cables 5a, 5b. In such a constitution, the probing stage 3 and the probing needles 4a, 4b are fixed to impose no stress on the coaxial cables 5a, 5b so that the measurement may be performed with high precision while facilitating the cleaning of probing needle ends.
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