| 摘要 |
PURPOSE:To improve the strength, bendability and solderability of a rolled and heat treated high tensile Cu alloy having high electrical conductivity and the adhesion of the alloy to plating by specifying the size of a precipitate in the alloy and the grain size of the alloy. CONSTITUTION:A Cu alloy contg. Ni, Si, etc., is manufactured by refining. The alloy is cast, cold rolled, subjected to soln. heat treatment and aged to regulate the size of a precipitate (the average diameter of precipitated grains) in the alloy to <=1mum and the grain size of the alloy to <=40mum. The resulting high tensile Cu alloy having high electrical conductivity shows superior strength, bendability, solderability and adhesion to plating.
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