| 摘要 |
PURPOSE:To simplify the structure of a metal mold and a resin-injection apparatus by a method wherein, after semiconductor device has been fixed to a device-mounting part and a lead-connecting part at a printed-circuit board has been resin-sealed by means of the metal mold in such a way that the device-mounting part is surrounded, the sassembly is sealed by an optically transmissive window material. CONSTITUTION:A printed, circuit board 10 which contains a device-mounting part 10a and circuit patterns 10b formed at the circumference of the part on on the surface of the board is prepared; an EPROM device 11 which is operated by the light is fixed to the device- mounting part 10a and is connected to internal edge parts of the circuit patterns 10b; after that, leads 13 for external extraction use are connected electrically and mechanically to external edge parts of the patterns. Then, a metal mold 14 for resin sealing use is prepared; the printed-circuit board 10 is set to a recessed part 14d at a low metal-mold 14-2; the bottom face of an upper metal-mold 14-1 is joined from above; the printed-circuit board 10 is fixed to the metal mold 14. After that, a resin material 15 is injected and is filled into upper and lower grooves 14b, 14e; after th resin material 15 has been hardened, the printed-board assembly is taken out form the metal mold 14; an upper opening part is sealed by an optically transmissive sheet-like window material 16 and the fixed by an adhesive agent 17. By this method, the structure of the metal mold and a resin-injection apparatus can be simplified.
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