发明名称 TEMPERATURE CONTROLLED HYBRID CIRCUIT
摘要 <p>A hybrid circuit structure includes an electrical circuit and a heating circuit therefor, both mounted on a single substrate. Valuable substrate space is saved by mounting the electrical circuit components on one surface of the substrate and the heating circuit elements on the opposite surface. A temperature control circuit is included, preferably mounted on the same surface as the electrical circuit components. Precision resistors for gain control and other functions may be provided on a separate substrate which may be mounted directly to the single substrate or to a separator therebetween. The precision resistors are in thermal contact with the temperature controlled heating circuit, thereby further increasing the stability of the circuit.</p>
申请公布号 GB2198593(A) 申请公布日期 1988.06.15
申请号 GB19870028066 申请日期 1987.12.01
申请人 * JOHN FLUKE MFG CO INC 发明人 LARRY E * ECCLESTON
分类号 G05D23/24;H01L23/34;H01L25/00;H05K1/02;H05K1/03;H05K1/14;H05K1/16;(IPC1-7):H05K7/20 主分类号 G05D23/24
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