| 摘要 |
<p>A wiring board for solder mounting of a flat package type integrated circuit device. The flat package type integrated circuit device has a plurality of leads arranged at spaced intervals, the plurality of leads including a reference lead, an end lead, and remaining leads positioned between the reference lead and end lead. The wiring board includes a board, a plurality of first pattern pads, each having a predetermined surface area, arranged on the board for mounting the remaining leads thereon, a second pattern pad having a second predetermined surface area arranged on the board for mounting the reference lead thereon, the second predetermined surface area of the second pattern pad being larger than the predetermined surface area of the first pattern pads, and a third pattern pad having a third predetermined surface area arranged on the board for mounting the end lead thereto, the third predetermined surface area of the third pattern pad being larger than the predetermined surface area of the first pattern pads.</p> |
