| 摘要 |
<p>PURPOSE:To prevent a cassette for housing a substrate to cool it from being damaged by heat by center-positioning a substrate to be processed, then matching the center of a semiconductor wafer to that of a placing base in a processing chamber to place it, performing ashing, further cooling, after the ashing, the substrate, thereby performing the uniform ashing. CONSTITUTION:A semiconductor wafer 5 is fed by an elevator 7a, and conveyed to a center-positioning mechanism 8. The wafer 5 is moved by a plurality of belts 12 embedded on a base 11, contacts a center-positioning guide 13, to finish center-positioning of the wafer 5. The center-positioned wafer 5 is placed on a placing base in a processing chamber 9 by a conveying mechanism, and ashed. The ashed wafer 5 is conveyed from the base in the chamber 9 by the conveying mechanism onto a cooling plate 10. The plate 10 is set in advance to approx. 15-20 deg.C by a temperature regulator to hold to cool the wafer 5.</p> |
