| 摘要 |
PURPOSE:To simplify a production process, to enhance a yield rate and to reduce a production cost by a method wherein an adhesive layer having an insulating function and a surface-protective function is formed between more than one semiconductor circuit substrate to be laminated mutually. CONSTITUTION:A vertical wiring part 3 of Ti-Au or the like is formed at an electrode 2 of a semiconductor circuit substrate 1 in such a way that is projects to the outside. An adhesive layer 4 is formed after the whole surface of the assembly has been coated with a thermoplastic resin adhesive agent, such as polyimide or the like, which has a surface-protective function and an insulating function. Then, this assembly is etched until the edge faces of the vertical wiring part 3 is exposed. Two semiconductor circuit boards 6, 6 which have been completed in this way are arranged in such a way that each edge face of the vertical wiring parts 3, 3 is faced to each other; after that, both semiconductor circuit boards 6, 6 are jointed by a thermal pressure method so that they are connected electrically to each other. |
