| 发明名称 |
FLEXIBLE COPPER-CLAD CIRCUIT BOARD. |
| 摘要 |
<p>This new flexible copper-clad circuit board consists of a copper foil bonded firmly and directly without an adhesive to a polyimide (1) film which is fluid at high temperature, the bonding being carried out at high temp.. The polyimide (1) has a repeat unit qwith the general formulae (I), (II), (III), etc. where R; nC-alkyl, nC-cycloalkyl, nC-aromatic, nC-condensed ring aromatic etc. n at least 2.</p> |
| 申请公布号 |
EP0270672(A1) |
申请公布日期 |
1988.06.15 |
| 申请号 |
EP19860904358 |
申请日期 |
1986.06.30 |
| 申请人 |
MITSUI TOATSU CHEMICALS, INCORPORATED |
发明人 |
OHTA, MASAHIRO;KAWASHIMA, SABURO;SONOBE, YOSHIHO;TAMAI, SHOJI;OIKAWA, HIDEAKI;YAMAGUCHI, AKIHIRO |
| 分类号 |
B32B15/08;C08G73/10;H05K1/03;H05K3/38;(IPC1-7):H05K1/03 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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